PACK MIC adapambana Mphotho ya Technology Innovation

Kuyambira pa Disembala 2 mpaka Disembala 4, motsogozedwa ndi China Packaging Federation ndipo yopangidwa ndi Komiti Yosindikiza ndi Kulemba Malemba ya China Packaging Federation ndi magawo ena, 2024 Msonkhano Wapachaka wa 20th Packaging Printing and Labeling and the 9th Packaging Printing and Labeling Works Grand Prix. Mwambo wa Mphotho, udachitika bwino ku Shenzhen, Province la Guangdong. PACK MIC adapambana Mphotho ya Technology Innovation.

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b

Kulowa: chikwama choteteza ana

c

Zipi yachikwamachi ndi zipi yapadera, kotero ana sangathe kutsegula mosavuta ndipo zomwe zili mkati sizidzagwiritsidwa ntchito molakwika!

Pamene zopakirazo zili zinthu zomwe siziyenera kugwiritsidwa ntchito kapena kukhudzidwa ndi ana, kugwiritsa ntchito thumba lachikwamali kungalepheretse ana kutsegula kapena kudya mwangozi, ndikuwonetsetsa kuti zomwe zili mkatizo sizivulaza ana komanso kuteteza thanzi la ana.

M'tsogolomu, PACK MIC ipitiliza kupititsa patsogolo luso laukadaulo ndikupitilizabe kupereka ntchito zabwinoko kwa makasitomala.

d

Nthawi yotumiza: Dec-06-2024